The global semiconductor packaging market is expected to reach USD 60.44 billion from USD 27.1 billion in 2020 to USD 60.44 billion in 2030, with a compound annual growth rate of 9.10% from 2021 to 2030

2021-11-25 06:46:58 By : Ms. Tina STW

The semiconductor package refers to the material containing the semiconductor device. The package is an enclosure that surrounds the circuit material to protect it from corrosion or physical damage, and allows the installation of electrical contacts that connect it to a printed circuit board (PCB).

New York, August 25, 2021 (GLOBE NEWSWIRE) - Reportlinker.com announced the release of the report "By type, packaging material, wafer material (simple semiconductors and compound semiconductors (III-V, II-VI, and IV-IV, Technology and Industry Vertical: 2021-2030 Global Opportunity Analysis and Industry Forecast"-https://www.reportlinker.com/p06126666/?utm_source=GNW With the rapid growth of the semiconductor packaging market, especially fan-out wafer-level packaging With the increasing demand for smartphones and devices and the Internet of Things (IoT), packaging suppliers are developing processes and methods to reduce the overall cost of advanced packaging and provide maximum operational efficiency. Recently, packaging is mainly used for high-end products and Applications related to niche markets, such as wafer and chip production, are due to their high operating costs. Prominent factors driving the growth of semiconductor packaging g The market includes the growth of Internet of Things (IoT) technology, the high adoption of consumer electronics devices, and semiconductors in the automotive industry The development trend of wafers. However, the high cost associated with semiconductor packaging materials hinders their adoption, which is expected to pose a major threat to the global semiconductor packaging market. However, the development trend of fan-out wafer-level packaging is expected to provide benefits for market growth Mapable opportunities. Global semiconductor packaging is subdivided into types, packaging materials, wafer materials, technologies, vertical industries, and regions. According to types, the market is divided into flip chip, embedded chip, fan-in WLP, and fan-out WLP. In On the basis of packaging materials, organic substrates, bonding wires, lead frames, ceramic packaging, chip mounting materials, etc. are analyzed. On the basis of wafer materials, they are divided into simple semiconductors and compound semiconductors. Simple semiconductors are further refined Divided into silicon (Si) and germanium (Ge). Compound semiconductors are further subdivided into III-V (gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), gallium phosphide (GaP), etc. ), II-VI (zinc sulfide (ZnS) and zinc selenide (ZnSe)) and IV-IV (silicon carbide (SiC) and silicon germanium (SiGe)). According to technology, the market is divided into grid arrays and small outline packages , Flat no-leads (Dual-flat no-leads (DFN) & Quad-flat no-leads (QFN)), dual-in-line packages (Plastic dual-in-line packages (PDIP) and ceramic dual-in-line packages) Packaging (CDIP)), etc. According to industry verticals, market research covers consumer electronics, automotive, healthcare, IT and telecommunications, aerospace and defense, etc. The automotive segment has the highest market share in 2020, while the consumer electronics segment It is expected to grow at the highest compound annual growth rate from 2021 to 2030. The semiconductor packaging market trends in North America, Europe, and Asia-Pacific are analyzed by region, and the pull Mia. Main market segmentation by type • Flip chip • Embedded DIE • Fan-in WLP • Fan-out WLP By packaging material • Organic substrate • Bonding wire • Lead frame • Ceramic package • Chip connection material • Other by wafer material • Simple semiconductor o Silicon (Si) o Germanium (Ge) • Compound semiconductor o III-V Gallium Arsenide (GaAs) Indium Phosphide (InP) Gallium Nitride (GaN) Gallium Phosphide (GaP) Others o II-VI Sulfide Zinc (ZnS) Zinc Selenide (ZnSe) o IV-IV Silicon Carbide (SiC) Silicon Germanium (SiGe) BY TECHNOLOGY • Grid Array • Small Outline Package • Flat No Lead Package o Dual Flat No Lead (DFN) o Quad Flat No-lead (QFN) •Dual in-line package o Plastic dual in-line package (PDIP) o Ceramic dual in-line package (CDIP) • Other end users • Consumer electronics • Automotive • Healthcare • IT and telecommunications • Aerospace and defense • Other regions (by region) • North America o United States o Canada o Mexico • Europe o United Kingdom o Germany o France o Italy o Rest of Europe • Asia Pacific o China o Japan o India o South Korea o Taiwan o Asia-Pacific others Regions • LAMEA o Latin America o Key players in the Middle East and Africa • Amkor Technology, Inc. • ASE Group • ChipMOS Technologies, Inc. • Powertech Technology, Inc. • Fujitsu Ltd. • Intel Corporation • Texas Instruments • Jiangsu Yangtze River Electronic Technology Co., Ltd. Company • Samsung Electronics Co., Ltd. • TSMC Read the full report: https://www.reportlinker.com/p06126666/?utm_source=GNW About Reportlinker ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you can get all the market research you need instantly in one place. __________________________

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