Spin–Orbit Qubit With A Single Hole Electrostatically Confined In A Natural Silicon Metal-Oxide-Semiconductor Device

2022-10-02 02:12:09 By : Ms. Anddy Su

A new technical paper titled “A single hole spin with enhanced coherence in natural silicon” was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS.

Abstract: “Semiconductor spin qubits based on spin–orbit states are responsive to electric field excitations, allowing for practical, fast and potentially scalable qubit control. Spin electric susceptibility, however, renders these qubits generally vulnerable to electrical noise, which limits their coherence time. Here we report on a spin–orbit qubit consisting of a single hole electrostatically confined in a natural silicon metal-oxide-semiconductor device. By varying the magnetic field orientation, we reveal the existence of operation sweet spots where the impact of charge noise is minimized while preserving an efficient electric-dipole spin control. We correspondingly observe an extension of the Hahn-echo coherence time up to 88 μs, exceeding by an order of magnitude existing values reported for hole spin qubits, and approaching the state-of-the-art for electron spin qubits with synthetic spin–orbit coupling in isotopically purified silicon. Our finding enhances the prospects of silicon-based hole spin qubits for scalable quantum information processing.”

Find the technical paper here. Published September 2022.

Piot, N., Brun, B., Schmitt, V. et al. A single hole spin with enhanced coherence in natural silicon. Nat. Nanotechnol. (2022). https://doi.org/10.1038/s41565-022-01196-z. Creative Commons License,

Related Reading Progress In Quantum Computing Commercial viability appears complicated, but feasible; timing still unknown. Quantum Computing Why this technology has taken so long to materialize, and what’s still missing. Quantum Knowledge Center Quantum Technical Papers

Name* (Note: This name will be displayed publicly)

Email* (This will not be displayed publicly)

Changes are steady in the memory hierarchy, but how and where that memory is accessed is having a big impact.

Fully self-driving cars will require AI that can learn as they drive.

Biden’s administration publishes strategy for implementing the CHIPS Act.

In a high-NA exposure stack, the resist is just the beginning.

Traditional metrics no longer work in the context of domain-specific designs and rising complexity.

Increased transistor density and utilization are creating memory performance issues.

The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.

Who’s doing what in next-gen chips, and when they expect to do it.

Is there about to be a major disruption in the EDA industry, coupled to the emerging era of domain specific architectures? Academia certainly thinks so.

100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.

Manufacturability reaches sufficient level to compete with flip-chip BGA and 2.5D.

Engineers are finding ways to effectively thermally dissipate heat from complex modules.

Steps are being taken to minimize problems, but they will take years to implement.